DC DC开关稳压器价格报价

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DC DC开关稳压器 9777 个产品
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包装
  • *(4)
  • Tray(3)
  • Tube(2573)
系列
  • -(3915)
  • AOZ(4)
  • AP1509(1)
  • AP1534(1)
  • AP3015(1)
  • AP34063(1)
  • AP3502(1)
  • AP3503(1)
  • AP3503E(1)
  • AP6502(1)
  • AZ34063U(1)
  • BD(1)
  • D-CAP+™(3)
  • D-CAP2™(16)
  • D-CAP2™, Eco-Mode™(19)
  • D-CAP™(2)
  • D-CAP™, Eco-Mode™(13)
  • DCS-Control™(65)
  • EZBoost(1)
  • EZBuck™(3)
  • EZBuck™(18)
  • Eco-Mode™(12)
  • EcoSpeed®(1)
  • Hyper Speed Control™, SuperSwitcher II™(6)
  • HyperLight Load®(48)
  • HyperLight Load®, SuperSwitcher IIG™(1)
  • H³®(1)
  • PAM2305(1)
  • PAM2321(1)
  • PolyPhase®(2)
  • Power Blox™(6)
  • RT(3)
  • SIMPLE SWITCHER®(1099)
  • SWIFT™(170)
  • SWIFT™, D-CAP2™(14)
  • SWIFT™, D-CAP2™, Eco-Mode™(11)
  • SWIFT™, Eco-Mode™(61)
  • SY(5)
  • SmartDrive™(1)
  • SmoothPWM™, Eco-Mode™(3)
  • SolarMagic™(1)
  • SupIRBuck™(38)
  • SuperSwitcher™(2)
  • SwitchReg™(1)
  • TinyBuck™(7)
  • USB Power Maximizer™(1)
  • iPOWIR™(3)
大小/尺寸
  • 1.20mm x 2.00mm x 0.5mm(1)
装配类型
  • *(4)
  • Surface Mount(5313)
  • Through Hole(727)
类型
  • -(3)
  • Adjustable(177)
  • Boost(5)
  • Buck(55)
  • Cuk(6)
  • Doubler, Inverting(1)
  • Dual Synchronous(5)
  • Dual-Output Converter(1)
  • Fixed(74)
  • Flyback, Forward Converter(3)
  • Flyback, Isolated(15)
  • Inverting(82)
  • Push-Pull Controller, Isolated(7)
  • Step-Down(2)
  • Step-Down (Buck)(3946)
  • Step-Down (Buck), Flyback, Isolated(3)
  • Step-Down (Buck), Inverting(12)
  • Step-Down (Buck), Inverting, Flyback(10)
  • Step-Down (Buck), Step-Up (Boost)(126)
  • Step-Down (Buck), Step-Up (Boost), Cuk, Flyback, Forward Converter(6)
  • Step-Down (Buck), Step-Up (Boost), Flyback, Sepic(6)
  • Step-Down (Buck), Step-Up (Boost), Inverting(187)
  • Step-Down (Buck), Step-Up (Boost), Inverting, Cuk(3)
  • Step-Down (Buck), Step-Up (Boost), Inverting, Cuk, Flyback, Forward Converter(83)
  • Step-Down (Buck), Step-Up (Boost), Inverting, Flyback(61)
  • Step-Down (Buck), Step-Up (Boost), Inverting, Flyback, Forward Converter(4)
  • Step-Down (Buck), Step-Up (Boost), Inverting, Sepic(1)
  • Step-Down (Buck), Step-Up (Boost), Switched Capacitor (Charge Pump)(62)
  • Step-Down (Buck), Switched Capacitor (Charge Pump)(19)
  • Step-Up (Boost)(566)
  • Step-Up (Boost), Flyback(5)
  • Step-Up (Boost), Flyback, Forward Converter(95)
  • Step-Up (Boost), Flyback, Forward Converter, Sepic(21)
  • Step-Up (Boost), Flyback, Sepic(50)
  • Step-Up (Boost), Inverting(23)
  • Step-Up (Boost), Inverting, Flyback, Forward Converter, Sepic(1)
  • Step-Up (Boost), Inverting, Flyback, Sepic(22)
  • Step-Up (Boost), Inverting, Sepic(11)
  • Step-Up (Boost), Sepic(2)
  • Step-Up (Boost), Switched Capacitor (Charge Pump)(87)
  • Step-Up (Boost), Switched Capacitor (Charge Pump), Divider, Doubler, Inverting(8)
  • Step-Up (Boost), Switched Capacitor (Charge Pump), Doubler(12)
  • Step-Up (Boost), Switched Capacitor (Charge Pump), Doubler, Inverting(6)
  • Step-Up (Boost), Switched Capacitor (Charge Pump), Inverting(13)
  • Switched Capacitor (Charge Pump)(41)
  • Switched Capacitor (Charge Pump), Divider(1)
  • Switched Capacitor (Charge Pump), Divider, Doubler(6)
  • Switched Capacitor (Charge Pump), Divider, Doubler, Inverting(52)
  • Switched Capacitor (Charge Pump), Divider, Inverting(4)
  • Switched Capacitor (Charge Pump), Doubler(34)
  • Switched Capacitor (Charge Pump), Doubler, Inverting(74)
  • Switched Capacitor (Charge Pump), Inverting(163)
  • Synchronous(30)
封装/外壳
  • *(2)
  • 10-TDFN (3x3)(1)
  • 10-TFQFN Exposed Pad, 10-MLF®(1)
  • 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)(192)
  • 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad(118)
  • 10-UFDFN Exposed Pad(2)
  • 10-VFDFN Exposed Pad(141)
  • 10-VFDFN Exposed Pad, 10-MLF®(2)
  • 10-VFDFN裸露焊盘(2)
  • 10-WDFN Exposed Pad(9)
  • 10-WDFN(3x3)(1)
  • 10-WFBGA(10)
  • 10-WFDFN Exposed Pad(141)
  • 10-WFDFN Exposed Pad, CSP(24)
  • 12-TSSOP (0.118", 3.00mm Width) Exposed Pad(7)
  • 12-UFBGA, DSBGA(9)
  • 12-VFDFN Exposed Pad(14)
  • 12-VFDFN Exposed Pad, 12-MLF®(6)
  • 12-VQFN Exposed Pad(1)
  • 12-WFBGA, DSBGA(6)
  • 12-WFDFN Exposed Pad(36)
  • 12-WFQFN Exposed Pad, CSP(1)
  • 12-WQFN Exposed Pad(5)
  • 13-VFQFN(1)
  • 14-DIP (0.300", 7.62mm)(5)
  • 14-SOIC (0.154", 3.90mm Width)(8)
  • 14-SOIC (0.295", 7.50mm Width)(30)
  • 14-TSSOP (0.173", 4.40mm Width)(8)
  • 14-TSSOP (0.173", 4.40mm Width) Exposed Pad(103)
  • 14-VDFN Exposed Pad(36)
  • 14-VFDFN Exposed Pad(3)
  • 14-VFDFN Exposed Pad, 14-MLF®(1)
  • 14-VFQFN Exposed Pad(15)
  • 14-WFDFN Exposed Pad(15)
  • 15-PowerVFQFN(1)
  • 15-PowerVQFN(16)
  • 15-VFQFN Exposed Pad(1)
  • 16-DIP (0.300", 7.62mm)(30)
  • 16-PowerVQFN(6)
  • 16-SOIC (0.154", 3.90mm Width)(28)
  • 16-SOIC (0.295", 7.50mm Width)(43)
  • 16-SOIC (0.295", 7.50mm Width) Exposed Pad(9)
  • 16-SSOP (0.154", 3.90mm Width)(56)
  • 16-SSOP (0.209", 5.30mm Width)(3)
  • 16-TFSOP (0.118", 3.00mm Width)(2)
  • 16-TFSOP (0.118", 3.00mm Width) Exposed Pad(28)
  • 16-TFSOP (0.118", 3.00mm) Exposed Pad, 12 leads(4)
  • 16-TFSOP (0.118", 3.00mm), 12 leads(2)
  • 16-TSSOP (0.173", 4.40mm Width)(33)
  • 16-TSSOP (0.173", 4.40mm Width) Exposed pad(191)
  • 16-UFBGA, DSBGA(4)
  • 16-UFBGA, WLCSP(1)
  • 16-VFQFN Exposed Pad(51)
  • 16-VFQFN Exposed Pad, 16-MLF®(1)
  • 16-VFQFN裸露焊盘(2)
  • 16-VQFN Exposed Pad(36)
  • 16-VQFN Exposed Pad, CSP(15)
  • 16-WFDFN Exposed Pad(38)
  • 16-WFQFN Exposed Pad(66)
  • 16-WQFN Exposed Pad(12)
  • 16-WQFN Exposed Pad, CSP(8)
  • 17-PowerVQFN(8)
  • 17-VQFN(3)
  • 18-DIP (0.300", 7.62mm)(7)
  • 18-VFDFN Exposed Pad(4)
  • 18-WFQFN Exposed Pad(2)
  • 198-BGA (159 bumps)(2)
  • 20-DIP (0.300", 7.62mm)(3)
  • 20-SOIC (0.295", 7.50mm Width)(14)
  • 20-SSOP (0.154", 3.90mm Width)(1)
  • 20-SSOP (0.209", 5.30mm Width)(2)
  • 20-TSSOP (0.173", 4.40mm Width) Exposed Pad(160)
  • 20-UFBGA(8)
  • 20-UFBGA, DSBGA(3)
  • 20-UFBGA, FCBGA(6)
  • 20-UFBGA, WLCSP(6)
  • 20-VFDFN Exposed Pad(1)
  • 20-VFQFN Exposed Pad(24)
  • 20-VFQFN Exposed Pad, 20-MLF®(1)
  • 20-VFQFN裸露焊盘(3)
  • 20-VSSOP (0.173", 4.40mm Width)(1)
  • 20-WFQFN Exposed Pad(13)
  • 20-WQFN Exposed Pad(2)
  • 22-LFDFN Exposed Pad(14)
  • 24-DIP (0.600", 15.24mm)(8)
  • 24-SOIC (0.295", 7.50mm Width)(12)
  • 24-TFSOP (0.173", 4.40mm Width)(1)
  • 24-TSSOP (0.173", 4.40mm Width)(3)
  • 24-VFQFN(2)
  • 24-VFQFN Exposed Pad(20)
  • 24-WFDFN Exposed Pad(3)
  • 24-WFQFN Exposed Pad(23)
  • 25-MLP(7)
  • 25-SOP(1)
  • 25-XFBGA, WLCSP(2)
  • 26-VFDFN Exposed Pad(4)
  • 28-MLPQ(4x4)(1)
  • 28-TSSOP (0.173", 4.40mm Width) Exposed Pad(56)
  • 28-UFQFN Exposed Pad(2)
  • 28-VFQFN(2)
  • 28-VFQFN Exposed Pad(4)
  • 28-VQFN Exposed Pad, 28-MLF®(3)
  • 28-WFBGA(5)
  • 28-WFQFN Exposed Pad(19)
  • 3-SIP Module(1)
  • 30-VFQFN Exposed Pad(1)
  • 32-SSOP (0.295", 7.50mm Width) Exposed Pad(2)
  • 32-VFQFN Exposed Pad(12)
  • 32-VFQFN Exposed Pad, 32-MLF®(1)
  • 32-VFQFN Exposed Pad, CSP(2)
  • 32-VFQFN裸露焊盘(1)
  • 32-WFQFN Exposed Pad(8)
  • 34-VQFN Exposed Pad(3)
  • 36-VFQFN Exposed Pad(9)
  • 36-WFQFN Exposed Pad(7)
  • 38-TFSOP (0.173", 4.40mm Width) Exposed Pad(3)
  • 38-WFQFN Exposed Pad(3)
  • 39-BQFN Exposed Pad(2)
  • 40-VFQFN Exposed Pad(12)
  • 40-WFQFN Exposed Pad(2)
  • 42-BQFN Exposed Pad(1)
  • 48-WFQFN Exposed Pad(2)
  • 5-WFBGA(29)
  • 5-WFBGA, WLCSP(15)
  • 5-XFBGA(2)
  • 52-VFQFN Exposed Pad(4)
  • 56-VFQFN Exposed Pad(3)
  • 6-MLP(11)
  • 6-SMD, No Lead(1)
  • 6-SSOP(1)
  • 6-TSOP (0.059", 1.50mm Width) 5 leads(16)
  • 6-TSSOP, SC-88, SOT-363(32)
  • 6-UDFN Exposed Pad(9)
  • 6-UFBGA, DSBGA(15)
  • 6-UFBGA, WLCSP(7)
  • 6-UFDFN(72)
  • 6-UFDFN Exposed Pad, 6-TMLF®(1)
  • 6-VDFN Exposed Pad(19)
  • 6-WDFN(3)
  • 6-WDFN Exposed Pad(89)
  • 6-WFBGA(12)
  • 6-WFBGA, WLCSP(5)
  • 6-WFDFN(2)
  • 6-WFDFN Exposed Pad(27)
  • 6-XFBGA, DSBGA(11)
  • 6-XFBGA, WLCSP(1)
  • 64-VFQFN Exposed Pad(1)
  • 8-CDIP (0.300", 7.62mm)(2)
  • 8-DIP (0.300", 7.62mm)(294)
  • 8-HSON(1)
  • 8-HTSOP-J(4)
  • 8-LTCC(1)
  • 8-MLP(2)
  • 8-MSOP(7)
  • 8-PowerVDFN(4)
  • 8-SMD,扁平引线裸焊盘(2)
  • 8-SO-EP(2)
  • 8-SOIC(6)
  • 8-SOIC (0.154", 3.90mm Width)(750)
  • 8-SOIC (0.154", 3.90mm Width) Exposed Pad(213)
  • 8-SOIC (0.173", 4.40mm Width)(3)
  • 8-SOIC (0.209", 5.30mm Width)(3)
  • 8-SOIC(0.154",3.90mm 宽)(3)
  • 8-SOP(3)
  • 8-SOP-EP(1)
  • 8-SOP-J(3)
  • 8-TSSOP (0.173", 4.40mm Width)(10)
  • 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)(202)
  • 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad(51)
  • 8-UFBGA, DSBGA(6)
  • 8-VCSP50L2(1)
  • 8-VDFN Exposed Pad(26)
  • 8-VFBGA(10)
  • 8-VFBGA, DSBGA(14)
  • 8-VFDFN Exposed Pad(18)
  • 8-VFDFN Exposed Pad, CSP(12)
  • 8-VFQFN Exposed Pad(1)
  • 8-VSSOP,8-MSOP(4)
  • 8-WCSP(2)
  • 8-WDFN Exposed Pad(28)
  • 8-WFBGA(3)
  • 8-WFDFN(6)
  • 8-WFDFN Exposed Pad(113)
  • 9-SIP,8引线(1)
  • 9-UFBGA, DSBGA(6)
  • 9-VBGA(2)
  • 9-WFBGA(3)
  • 9-XFBGA(1)
  • 9-XFBGA,CSPBGA(1)
  • DFN2x2-8(1)
  • DFN2x2_8L(1)
  • DFN5x4-8L(1)
  • DIP-16(3)
  • DIP-8(3)
  • Die(1)
  • HRP7(2)
  • Heptawatt-7 (Horizontal, Bent and Staggered Leads)(1)
  • Heptawatt-7 (Vertical, Bent and Staggered Leads)(3)
  • MSOP-8(1)
  • Module(2)
  • Multiwatt-15 (Horizontal, Bent and Staggered Leads)(1)
  • Multiwatt-15 (Vertical, Bent and Staggered Leads)(9)
  • PSOP-8(1)
  • Power Block (LGA)(1)
  • QFN (4x4)(4)
  • QFN-20(1)
  • QFN23(1)
  • QFN5x5-30L(1)
  • SC-74, SOT-457(11)
  • SC-74A, SOT-753(189)
  • SO-8EP(1)
  • SO8E(1)
  • SOIC-16(1)
  • SOIC-8(4)
  • SON008V5060(3)
  • SOP-16(2)
  • SOP-8(2)
  • SOP-8L (EP)(2)
  • SOT-23-5 Thin, TSOT-23-5(94)
  • SOT-23-6(78)
  • SOT-23-6 Thin, TSOT-23-6(111)
  • SOT-23-6L(3)
  • SOT-23-8(4)
  • SOT-23-8 Thin, TSOT-23-8(5)
  • SOT23-5(1)
  • SOT23-6(2)
  • TDFN (2x2)-8(2)
  • TDFN (3x3) 10-pin(1)
  • TDFN 10(2)
  • TDFN 3x3 10(14)
  • TDFN 8(3)
  • TDFN2x2-8(5)
  • TO-220-5(106)
  • TO-220-5 Formed Leads(158)
  • TO-220-5 Full Pack (Formed Leads)(1)
  • TO-220-5成形引线(2)
  • TO-220-7(2)
  • TO-220-7 Formed Leads(81)
  • TO-226-3, TO-92-3 (TO-226AA) Formed Leads(1)
  • TO-252-5(3)
  • TO-252-6, DPak (5 Leads + Tab)(3)
  • TO-263-6, D²Pak (5 Leads + Tab), TO-263BA(265)
  • TO-263-7 Thin(43)
  • TO-263-8, D²Pak (7 Leads + Tab), TO-263CA(198)
  • TO-263-8,D²Pak(7引线+接片),TO-263CA(1)
  • TO220CP-V5(1)
  • TO252S-5(1)
  • TQFN 3x3 16(9)
  • TSOT 23-5(6)
  • TSOT 23-6(5)
  • TSOT-23-5(1)
  • TSOT23-6(1)
  • U-QFN3030-16(1)
  • VQFN016V3030(3)
  • VQFN020V4040(2)
  • VQFN040-V6060(1)
  • VSON008X2030(1)
  • WL-CSP 8-bumps(1)
操作温度
  • -(13)
  • -10°C ~ 100°C(7)
  • -10°C ~ 85°C(7)
  • -15°C ~ 70°C(1)
  • -20°C ~ 125°C(1)
  • -20°C ~ 70°C(4)
  • -20°C ~ 80°C(1)
  • -20°C ~ 85°C(59)
  • -25°C ~ 105°C(4)
  • -25°C ~ 125°C(26)
  • -25°C ~ 85°C(25)
  • -25°C ~ 90°C(1)
  • -30°C ~ 125°C(13)
  • -30°C ~ 85°C(93)
  • -40°C ~ 100°C(28)
  • -40°C ~ 105°C(41)
  • -40°C ~ 115°C(1)
  • -40°C ~ 125°C(2695)
  • -40°C ~ 140°C(2)
  • -40°C ~ 150°C(265)
  • -40°C ~ 80°C(15)
  • -40°C ~ 85°C(2540)
  • -40°C ~ 95°C(1)
  • -45°C ~ 85°C(1)
  • -55°C ~ 125°C(27)
  • -55°C ~ 150°C(4)
  • -55°C ~ 175°C(2)
  • -65°C ~ 150°C(1)
  • 0°C ~ 100°C(49)
  • 0°C ~ 105°C(1)
  • 0°C ~ 125°C(111)
  • 0°C ~ 70°C(475)
  • 0°C ~ 85°C(10)
  • –40°C~125°C(1)
  • –40°C~85°C(2)
供应商器件封装
  • *(7)
  • -(2)
  • 10-DFN (3x2)(4)
  • 10-DFN (3x3)(112)
  • 10-DSBGA(8)
  • 10-LFCSP-WD (3x3)(24)
  • 10-MLF® (2.5x2)(1)
  • 10-MLF® (3x3)(2)
  • 10-MLP (3x3)(1)
  • 10-MLPD (3x3)(2)
  • 10-MSOP(81)
  • 10-MSOP-EP(60)
  • 10-MSOP-PowerPad(51)
  • 10-Microbump(2)
  • 10-SON (2.5x2.5)(10)
  • 10-SON (3x3)(122)
  • 10-TDFN (2x2)(1)
  • 10-TDFN (3x3)(1)
  • 10-TDFN-EP (3x3)(2)
  • 10-UDFN (3x3)(2)
  • 10-VSON (3x3)(2)
  • 10-VSSOP(99)
  • 10-WDFN (3x3)(1)
  • 10-WSON (3x2)(3)
  • 10-WSON (3x3)(22)
  • 10-WSON (4x4)(9)
  • 10-uMAX(19)
  • 12-DFN (3x3)(5)
  • 12-DFN (4x3)(17)
  • 12-DSBGA(8)
  • 12-DSBGA (1.53x1.98)(7)
  • 12-LFCSP-WQ (3x3)(1)
  • 12-MLF-EP™ (4x4)(1)
  • 12-MLF™ (3x3)(5)
  • 12-MLP (3.5x3)(6)
  • 12-MSOP, Exposed Pad(7)
  • 12-QFN (4x4)(1)
  • 12-TDFN (3x3)(13)
  • 12-TQFN (4x4)(5)
  • 12-WSON (3x3)(5)
  • 13-VQFN (3x3)(1)
  • 14-DFN (4x3)(11)
  • 14-HTSSOP(95)
  • 14-MLF® (3x3.5)(1)
  • 14-PDIP(5)
  • 14-QFN (3.5x3.5)(11)
  • 14-SOIC(7)
  • 14-SOICW(30)
  • 14-TSSOP(8)
  • 14-TSSOP-EP(8)
  • 14-VQFN (3.5x3.5)(4)
  • 14-VSON (4x3)(3)
  • 14-VSON (5x6)(36)
  • 14-WDFN (4x3)(1)
  • 14-WSON (4x4)(3)
  • 15-Multiwatt(10)
  • 15-PQFN (3.5x3.5)(1)
  • 15-VQFN (3.5x3.5)(1)
  • 16-DFN (5x3)(8)
  • 16-DFN (5x4)(8)
  • 16-DIP(14)
  • 16-DSBGA (1.56x1.56)(1)
  • 16-DSBGA (2x2)(3)
  • 16-HTSSOP(70)
  • 16-LFCSP-VQ (4x4)(15)
  • 16-LFCSP-WQ (3x3)(7)
  • 16-LFCSP-WQ (4x4)(1)
  • 16-LLP-EP (4x4)(6)
  • 16-MLF® (4x4)(1)
  • 16-MSOP(4)
  • 16-MSOP, Exposed Pad(32)
  • 16-PDIP(13)
  • 16-PowerDIP(2)
  • 16-PowerQFN(6)
  • 16-QFN (3x3)(55)
  • 16-QFN (4x4)(36)
  • 16-QFN (4x5)(1)
  • 16-QFN (5x6)(2)
  • 16-QFN-EP (3x3)(17)
  • 16-QSOP(32)
  • 16-SO W(7)
  • 16-SOIC(39)
  • 16-SOIC W(35)
  • 16-SSOP(24)
  • 16-TQFN (3x3)(22)
  • 16-TQFN (5x5)(7)
  • 16-TSSOP(34)
  • 16-TSSOP-EP(120)
  • 16-VQFN (3x3)(1)
  • 16-WLCSP(1)
  • 16-WQFN (3x3)(23)
  • 16-WSON (5x4)(5)
  • 16-WSON (5x5)(13)
  • 17-MLF® (2.5x2.8)(1)
  • 17-PQFN (4x5)(2)
  • 17-PQFN (5x6)(4)
  • 17-PowerQFN (4x5)(2)
  • 18-DFN (5x6)(4)
  • 18-DIP(7)
  • 18-MLPQ-W (2x3)(2)
  • 20-DFN (4x5)(1)
  • 20-DSBGA(3)
  • 20-Flip-Chip(6)
  • 20-HTSSOP(114)
  • 20-HTSSOP-B(1)
  • 20-MLF® (3x4)(1)
  • 20-PowerDIP(3)
  • 20-QFN (3x3)(2)
  • 20-QFN (3x4)(18)
  • 20-QFN (4x4)(4)
  • 20-QFN (5x4)(3)
  • 20-QFN Exposed Pad (4x4)(3)
  • 20-SO(11)
  • 20-SOIC(3)
  • 20-SSOP(3)
  • 20-TSSOP-EP(46)
  • 20-VQFN(2)
  • 20-VQFN (3.5x4.0)(1)
  • 20-WLCSP(5)
  • 20-WLP (2.15x1.94)(1)
  • 20-uSMD(8)
  • 22-SON-EP (6x5)(14)
  • 24-DFN (7x4)(3)
  • 24-DIP(8)
  • 24-LLP-EP (4x4)(1)
  • 24-QFN (3x5)(4)
  • 24-QFN (4x4)(17)
  • 24-QFN Exposed Pad (4x4)(11)
  • 24-SOIC(12)
  • 24-TSSOP(4)
  • 24-VQFN (4x4)(8)
  • 24-VQFN (5x4)(3)
  • 24-WQFN (4x4)(1)
  • 25-HSOP(1)
  • 25-MLP (5x6)(7)
  • 25-WLCSP(2)
  • 26-DFN (7x4)(4)
  • 28-HTSSOP(43)
  • 28-MLF® (5x6)(3)
  • 28-MLPQ (4x4)(2)
  • 28-QFN (4x5)(12)
  • 28-QFN (5x6)(4)
  • 28-TQFN (4x4)(2)
  • 28-TSSOP-EP(13)