概述
The QCS6490 processors are designed to offer a combination of high-performance compute, edge AI loads, scalability, connectivity, and power efficiency with multi-OS support across Linux, Android, Ubuntu, and Windows.
There is pin-to-pin compatibility between QCS5430 and QCS6490 hardware to match varying performance and connectivity needs.
Equipped with a multi-core CPU (up to 8 cores), GPU, and AI engine (NPU & DSP) delivering up to 12 dense TOPS, these processors enable devices to perfo...
Benefits
Use Cases
Diagram
Companion Chips
Development Hardware
概述
The QCS6490 processors are designed to offer a combination of high-performance compute, edge AI loads, scalability, connectivity, and power efficiency with multi-OS support across Linux, Android, Ubuntu, and Windows.
There is pin-to-pin compatibility between QCS5430 and QCS6490 hardware to match varying performance and connectivity needs.
Equipped with a multi-core CPU (up to 8 cores), GPU, and AI engine (NPU & DSP) delivering up to 12 dense TOPS, these processors enable devices to perfo...
Benefits
Use Cases
Diagram
Companion Chips
Development Hardware
QCS6490 型号参数
| 属性 | 参数值 |
|---|---|
| Package | BGA |
| Qualcomm® Artificial Intelligence (AI) Engine_GPU Name | Qualcomm® Adreno™ 643L |
| Qualcomm® Artificial Intelligence (AI) Engine_CPU Name | Qualcomm® Kryo™ 670 |
| Qualcomm® Artificial Intelligence (AI) Engine_CPU Number of Cores | 8 |
| Qualcomm® Artificial Intelligence (AI) Engine_Qualcomm® Hexagon™ Processor Name | Qualcomm® Hexagon™ 770 |
| Qualcomm® Artificial Intelligence (AI) Engine_Qualcomm® Hexagon™ Processor Features | Qualcomm® Hexagon™ Vector eXtensions (HVX), Large shared AI memory, Qualcomm® Hexagon™ Scalar Accelerator, Qualcomm® Hexagon™ Tensor Accelerator |
| Qualcomm® Artificial Intelligence (AI) Engine_Qualcomm® Sensing Hub Generation | 2nd |
| Qualcomm® Artificial Intelligence (AI) Engine_Qualcomm® Sensing Hub Features | Qualcomm® Sensing Hub |
| Qualcomm® Artificial Intelligence (AI) Engine_Tera Operations Per Second (TOPS) | 12 TOPS |
| CPU_Name | Qualcomm® Kryo™ 670 |
| CPU_Architecture | 64-bit |
| CPU_Clock Speed | Up to 2.7 GHz |
| NPU_Tera Operations Per Second | 12 TOPS |
| GPU_Name | Qualcomm® Adreno™ 643 |
| GPU_Clock Speed | Up to 812 MHz |
| GPU_APIs | DirectX® FL 12, OpenCL™ 2.0, Vulkan®, OpenGL® ES 3.2 |
| Memory_Speed | 3200 MHz |
| Memory_Type | LPDDR5 |
| Memory_Density | Up to 16 GB |
| Memory_Bit Width | 16-bit |
| Memory_Number of Channels | 2 |
| DSP_Name | Qualcomm® Hexagon™ |
| DSP_Packets Per Second | 1980 MPPS |
| Audio_Qualcomm Aqstic™ technology support | Qualcomm Aqstic™ smart speaker amplifier |
| Audio_Qualcomm® aptX™ audio technology support | Qualcomm® aptX™ Voice |
| Audio_Interface Type | 6x TDM/PCM/ Inter-Integrated Circuit Sound (I²S), 3x Digital Microphone In |
| Display_Display Processing Unit (DPU) Name | Qualcomm® Adreno™ 1075 |
| Display_Maximum On-Device Display Resolution | FHD+ @ 144 Hz |
| Display_Maximum External Display Resolution | 4K @ 60 Hz |
| Display_Pixels | 1080 × 2520 |
| Display_High Dynamic Range (HDR) | HDR10+ |
| Display_Color Depth | Up to 10-bit |
| Display_Color Gamut | Rec. 2020 |
| Display_Number of Concurrent Displays | 2 |
| Display_Interface Type | 1x DisplayPort 1.4 Single-Stream Transport (SST), 1x 4-lane Display Serial Interface (DSI), 2x PCIe |
| Video Playback_Resolution | 1x 4K @ 60 fps, 2x 4K @ 30 fps, 4x 1080p @ 60 fps |
| Video Playback_Codecs | H.264 (Advanced Video Coding (AVC)), H.265 (High Efficiency Video Coding (HEVC)), VP9 |
| Video Playback_Features | HDR Vivid |
| Video Encode_Resolution | 1x 4K @ 30 fps, 4x 1080p @ 30 fps |
| Video Encode_Codecs | H.264 (Advanced Video Coding (AVC)), H.265 (High Efficiency Video Coding (HEVC)) |
| Camera_Image Signal Processor (ISP) Name | Qualcomm® Spectra™ 570L |
| Camera_Image Signal Processor (ISP) Type | Image Signal Processor (ISP) |
| Camera_Image Signal Processor (ISP) Number | Triple ISP |
| Camera_Image Signal Processor (ISP) Bit Depth | 14-bit |
| Camera_Inputs | 5 cameras |
| Camera_Triple Camera | 22+22+22 MP |
| Camera_Dual Camera | 36+22 MP |
| Camera_Single Camera (MFNR, ZSL, 30 fps) | 108 MP |
| Camera_Single Camera (ZSL, 30 fps) | 64 MP |
| Camera_Single Camera | 64 MP |
| Camera_Features | Mega Low light photography |
| Camera_Video Capture | 4K @ 30 fps |
| Camera_Slow Motion Video Capture | 720p @ 960 fps |
| Camera_Video Capture Formats | HDR10+, HDR10 |
| Camera_Video Capture Features | Engine for Visual Analytics 3.0 |
| Camera_Interface Type | 4x 4-lane Camera Serial Interface (CSI) |
| PCIe_Number of Interfaces | 2 |
| PCIe_Specification Version | 2x PCIe 3.0 |
| Universal Serial Bus (USB)_Interface Type | USB 3.0 Type-C |
| Universal Serial Bus (USB)_Specification Version | 1x USB 2.0, 1x USB 3.1 |
| Interfaces_Supported Interfaces | 169x GPIO, 21x QUP |
| Storage_eMMC | eMMC 5.1 |
| Storage_SD | SD 3.0 |
| Storage_SSD/NVMe Interface | NVMe over PCIe |
| Storage_UFS | UFS 3.1 |
| Software Options_Operating System | Ubuntu, Windows, Android, Linux |
| Location_Location Support | Qualcomm® Location Suite |
| Location_Satellite Systems | Galileo, Beidou, QZSS, SBAS, NavIC, GLONASS |
| Location_Frequency Support | Dual (L1/L5) |
| Location_Accuracy | Lane-level, Sidewalk-level |
| Location_Features | Global Freeway Vehicle Navigation |
| NFC_Near Field Communications | Supported |
| Wi-Fi_Wi-Fi/Bluetooth System | Qualcomm® FastConnect™ 6700, Qualcomm® FastConnect™ 6900 |
| Wi-Fi_Peak Speed | 3.6 Gbps |
| Wi-Fi_Generation | Wi-Fi 6E |
| Wi-Fi_Standards | 802.11b, 802.11ac, 802.11g, 802.11n, 802.11ax |
| Wi-Fi_Spectral Bands | 2.4 GHz, 6 GHz, 5 GHz |
| Wi-Fi_Channels | 40 MHz, 160 MHz, 20 MHz, 80 MHz |
| Wi-Fi_MIMO Configuration | 2x2 |
| Wi-Fi_Peak QAM | 4K QAM |
| Wi-Fi_Security | WPA3 |
| Wi-Fi_Features | MU-MIMO (UL/DL), Dual-Band Simultaneous (DBS), OFDMA |
| Bluetooth_Wi-Fi/Bluetooth System | Qualcomm® FastConnect™ 6700, Qualcomm® FastConnect™ 6900 |
| Bluetooth_Specification Version | Bluetooth® 5.2 |
| Bluetooth_Topologies | Dual Bluetooth® Radios |
| Bluetooth_Low Energy Features | Bluetooth® Low Energy Audio |
| Security_Fingerprint Sensor | Qualcomm® 3D Sonic Sensor Max |
| Security_Secure Processing Unit (SPU) | Biometric Authentication (Face) |
| Security_Features | Qualcomm® Wireless Edge Services (WES) |
| Charging_Qualcomm® Quick Charge™ technology support | Qualcomm® Quick Charge™ 5 technology |
| Process Node and Technology_Process Node | 6 nm |
| Package_Size | 14 × 12 × 0.91 mm |
| Package_Pitch | 0.35 mm |
| Operating Temperature Range_Minimum Temperature | -30 °C |
| Operating Temperature Range_Maximum Temperature | 105℃ |
| Longevity Program_Expected Date to Remain in Longevity Program Until | 2036 |
| Longevity Program_Longevity Period | 15 year(s) |
